Browse "MS-Journal Papers(저널논문)" by Author Yim, MJ
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| Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications Yim, MJ; Kim, HJ; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.1165 - 1171, 2005-08 |
| Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications Yim, MJ; Hwang, J; Paik, Kyung-Wook, INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, v.27, pp.77 - 84, 2007-01 |
| Design and understanding of Anisotropic Conductive Films (ACFs) for LCD packaging Yim, MJ; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, v.21, no.2, pp.226 - 234, 1998-06 |
| Effect of conductive particle properties on the reliability of anisotropic conductive film for chip-on-glass applications Yim, MJ; Chung, CK; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, pp.306 - 312, 2007-10 |
| Effect of filler content on the dielectric properties of anisotropic conductive adhesives materials for high-frequency flip-chip interconnection Yim, MJ; Kwon, W; Paik, Kyung-Wook, MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, v.126, pp.59 - 65, 2006-01 |
| Effect of nonconducting filler additions on ACA properties and the reliability of ACA flip-chip on organic substrates Yim, MJ; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.24, no.1, pp.24 - 32, 2001-03 |
| Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application Hwang, JS; Yim, MJ; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.48, pp.293 - 299, 2008-02 |
| Effects of epoxy functionality on the properties and reliability of the anisotropic conductive films for flip chips on organic substrates Hwang, JS; Yim, MJ; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.35, pp.1722 - 1727, 2006-09 |
| Effects of silica filler and diluent on material properties and reliability of nonconductive pastes (NCPs) for flip-chip applications Jang, KW; Kwon, WS; Yim, MJ; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.27, pp.608 - 615, 2004-09 |
| Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly Hwang, JW; Yim, MJ; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.1455 - 1461, 2005-11 |
| Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications Yim, MJ; Jeong, IH; Choi, HK; Hwang, JS; Ahn, JY; Kwon, W; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.28, pp.789 - 796, 2005-12 |
| Highly reliable flip-chip-on-flex package using multilayered anisotropic conductive film Yim, MJ; Hwang, JS; Kim, JG; Ahn, JY; Kim, HJ; Kwon, WS; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.33, pp.76 - 82, 2004-01 |
| Highly reliable non-conductive adhesives for flip chip CSP applications Yim, MJ; Hwang, JS; Kwon, W; Jang, KW; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING , v.26, pp.150 - 155, 2003-04 |
| Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications Yim, MJ; Ryu, W; Jeon, YD; Lee, J; Ahn, Seungyoung; Kim, Joungho; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.22, no.4, pp.575 - 581, 1999-12 |
| Microwave modeling and characterization of anisotropic conductive adhesive flip-chip interconnection Yim, MJ; Jeon, YD; Paik, Kyung-Wook; Ryu, W; Lee, J; Kim, Joungho, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.35, pp.753 - 758, 1999-12 |
| Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications Yim, MJ; Paik, Kyung-Wook, INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, v.26, pp.304 - 313, 2006-08 |
| Reduced thermal strain in flip chip assembly on organic substrate using low cte anisotropie conductive film Yim, MJ; Jeon, YD; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING , v.23, no.3, pp.171 - 176, 2000-07 |
| The contact resistance and reliability of anisotropically conductive film (ACF) Yim, MJ; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.22, no.2, pp.166 - 173, 1999-05 |
| Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation Kwon, WS; Yim, MJ; Paik, Kyung-Wook; Ham, SJ; Lee, Soon-Bok, JOURNAL OF ELECTRONIC PACKAGING, v.127, pp.86 - 90, 2005-06 |
| Wafer-level flip chip packages using preapplied anisotropic conductive films (ACFs) Son, HY; Chung, CK; Yim, MJ; Hwang, JS; Paik, Kyung-Wook; Jung, GJ; Lee, JK, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, no.3, pp.221 - 227, 2007-07 |
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