Browse "MS-Journal Papers(저널논문)" by Author Yang, Ming
Showing results 1 to 5 of 5
| A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250 degrees C Bonding Temperature Zhang, Shuye; Yang, Ming; Wu, Yang; Du, Jikun; Lin, Tiesong; He, Peng; Huang, Mingliang; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.3, pp.383 - 391, 2018-03 |
| A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives Zhang, Shuye; Qi, Xiaoquan; Yang, Ming; Cao, Yang; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.10, pp.9171 - 9183, 2019-05 |
| Branched Aramid Nanofibers Zhu, Jian; Yang, Ming; Emre, Ahmet; Bahng, Joong Hwan; Xu, Lizhi; Yeom, Jihyeon; Yeom, Bongjun; et al, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, v.56, no.39, pp.11744 - 11748, 2017-09 |
Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers Zhang, Shuye; Yang, Ming; Jin, Ming Liang; Huang, Wen-Can; Lin, Tiesong; He, Peng; Lin, Panpan; et al, METALS, v.8, no.1, 2018-01 |
| Universal Synthesis of Single-Phase Pyrite FeS2 Nanoparticles, Nanowires, and Nanosheets Bai, Yongxiao; Yeom, Jihyeon; Yang, Ming; Cha, Sang-Ho; Sun, Kai; Kotov, Nicholas A., JOURNAL OF PHYSICAL CHEMISTRY C, v.117, no.6, pp.2567 - 2573, 2013-02 |
Discover
Open Access
- 265 OA Article
Date issued
- 1,015 2020 - 2024
- 2,625 2010 - 2019
- 2,168 2000 - 2009
- 1,240 1990 - 1999
- 179 1980 - 1989