Browse "MS-Journal Papers(저널논문)" by Author Xu, Jianhao
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| In-situ isothermal aging TEM analysis of a micro Cu/ENIG/Sn solder joint for flexible interconnects Liu, Jinhong; Xu, Jianhao; Paik, Kyung-Wook; He, Peng; Zhang, Shuye, JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, v.169, pp.42 - 52, 2024-01 |
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