Browse "MS-Journal Papers(저널논문)" by Author Suk, KyoungLim
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| Advancing electronic packaging using microsolder balls: Making 25-nm pitch interconnection possible Suk, KyoungLim; Han, Joon; Lee, Jeongyong; Paik, Kyung-Wook, IEEE NANOTECHNOLOGY MAGAZINE, v.7, no.1, pp.24 - 30, 2013 |
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