Browse "MS-Journal Papers(저널논문)" by Author Suh, MS
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| Effects of plating parameters on alloy composition and microstructure of Sn-Bi electrodeposits from methane sulphonate bath Suh, MS; Park, CJ; Kwon, Hyuk-Sang, SURFACE & COATINGS TECHNOLOGY, v.200, pp.3527 - 3532, 2006-03 |
| Growth kinetics of Cu-Sn intermetallic compounds at interface of 80Sn-20Pb electrodeposits and Cu based leadframe alloy, and its influence on the fracture resistance to 90 degrees-bending Suh, MS; Kwon, Hyuk-Sang, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.39, no.10, pp.6067 - 6073, 2000-10 |
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