Browse "MS-Journal Papers(저널논문)" by Author Song, JY
Showing results 1 to 8 of 8
| Analyses of the practical adhesion strengths of the metal/polymer interfaces in electronic packaging Yu, Jin; Song, JY; Park, IS, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.12, pp.1347 - 1352, 2002-12 |
| Analysis of phase transformation kinetics by intrinsic stress evolutions during the isothermal aging of amorphous Ni(P) and Sn/Ni(P) films Song, JY; Yu, Jin; Lee, TY, JOURNAL OF MATERIALS RESEARCH, v.19, no.4, pp.1257 - 1264, 2004-04 |
| Analysis of the T-peel strength in a Cu/Cr/polyimide system Song, JY; Yu, Jin, ACTA MATERIALIA, v.50, no.16, pp.3985 - 3994, 2002-09 |
| Artificial synaptic devices based on biomimetic electrochemistry: A review Baek, Ji Hyun; Im, In Hyuk; Hur, Eun-Mi; Park, Jungwon; Lim, Jongwoo; Kim, Sangbum; Kang, Kibum; et al, MATERIALS RESEARCH BULLETIN, v.176, 2024-08 |
| Effect of phosphorous content on phase transformation induced stress in Sn/Ni(P) thin films Song, JY; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.21, no.9, pp.2261 - 2269, 2006-09 |
| Effects of reactive diffusion on stress evolution in Cu-Sn films Song, JY; Yu, Jin; Lee, TY, SCRIPTA MATERIALIA, v.51, no.2, pp.167 - 170, 2004-07 |
| Relationship between mechanical properties and microstructure of ultra-fine gold bonding wires Kim, KS; Song, JY; Chung, EK; Park, JK; Hong, Soon-Hyung, MECHANICS OF MATERIALS, v.38, pp.119 - 127, 2006-01 |
| Residual stress measurements in electroless plated Ni-P films Song, JY; Yu, Jin, THIN SOLID FILMS, v.415, no.1-2, pp.167 - 172, 2002-08 |
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