Browse "MS-Journal Papers(저널논문)" by Author Shim, KC
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| Bottom-up filling of submicrometer features in catalyst-enhanced chemical vapor deposition of copper Shim, KC; Lee, HB; Kwon, OK; Park, HS; Koh, W; Kang, Sang-Won, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.149, no.2, pp.109 - 113, 2002-02 |
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