Browse "MS-Journal Papers(저널논문)" by Author Shih, DY
Showing results 1 to 7 of 7
| Controlling Ag3Sn plate formation, in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying Kang, SK; Shih, DY; Leonard, D; Henderson, DW; Gosselin, T; Cho, SI; Yu, Jin; et al, JOM, v.56, no.6, pp.34 - 38, 2004-06 |
| Effects of phosphorus content on the reaction of electroless Ni-P with Sn and crystallization of Ni-P Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Choi, WK, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.7, pp.790 - 795, 2004-07 |
| Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition Kang, SK; Leonard, D; Shih, DY; Gignac, L; Henderson, DW; Cho, S; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.3, pp.479 - 485, 2006-03 |
| Oxidation study of pure tin and its alloys via electrochemical reduction analysis Cho, S; Yu, Jin; Kang, SK; Shih, DY, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.5, pp.635 - 642, 2005-05 |
| Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, JOURNAL OF MATERIALS RESEARCH, v.19, no.8, pp.2428 - 2436, 2004-08 |
| Study of the reaction mechanism between electroless Ni-P and Sn and its effect on the crystallization of Ni-P Sohn, YC; Yu, Jin; Kang, SK; Choi, WK; Shih, DY, JOURNAL OF MATERIALS RESEARCH, v.18, no.1, pp.4 - 7, 2003-01 |
| The oxidation of lead-free Sn alloys by electrochemical reduction analysis Cho, S; Yu, Jin; Kang, SK; Shih, DY, JOM, v.57, no.6, pp.50 - 52, 2005-06 |
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