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Chemical vapor deposition of an electroplating Cu seed layer using hexafluoroacetylacetonate Cu(1,5-dimethylcyclooctadiene)

Lee, WH; Ko, YK; Byun, IJ; Seo, BS; Lee, JG; Reucroft, PJ; Lee, JU; et al, JOURNAL OF VACUUM SCIENCE TECHNOLOGY A-VACUUM SURFACES AND FILMS, v.19, no.6, pp.2974 - 2978, 2001-11

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