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Showing results 1 to 6 of 6

1
Acoustic Matching Layer Films Using B-Stage Thermosetting Polymer Resins for Ultrasound Transducer Applications

Park, Jae-Hyeong; Lee, Sang-Mok; Park, Jongcheol; Lee, Hyunjoo Jenny; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, v.67, no.10, pp.2148 - 2154, 2020-10

2
Effects of Polymer Ball Size and Polyvinylidene Fluoride Nanofiber on the Ball Capture Rate for 100-mu m-Pitch Flex-on-Flex Assembly Using Anisotropic Conductive Films and Ultrasonic Bonding Method

Park, Jae-Hyeong; Kim, Tae Wan; Zhang, Shuye; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.7, pp.1127 - 1134, 2016-07

3
Joint Morphologies and Failure Mechanisms of Anisotropic Conductive Films (ACFs) During a Power Handling Capability Test for Flex-On-Board Applications

Zhang, Shuye; Park, Jae-Hyeong; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.12, pp.1820 - 1826, 2016-12

4
Low-Temperature Bonding of PZT (PbZrTiO3) and Flexible Printed Circuits Using Sn52In Solder Anisotropic Conductive Films for Flexible Ultrasonic Transducers

Park, Jae-Hyeong; Park, Jong Cheol; Shin, SangMyung; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.11, pp.2152 - 2159, 2019-11

5
Piezoelectric Ceramics and Flexible Printed Circuits' Interconnection Using Sn58Bi Solder Anisotropic Conductive Films for Flexible Ultrasound Transducer Assembly

Park, Jae-Hyeong; Park, Jong Cheol; Lee, SeYong; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.9, pp.1897 - 1903, 2019-09

6
The Effect of the Thermal Mechanical Properties of Nonconductive Films on the Thermal Cycle Reliability of 40-mu m Fine Pitch Cu-Pillar/Ni/SnAg Microbump Flip-Chip Assembly

Lee, SeYong; Park, JongHo; Park, Jae-Hyeong; Lee, HanMin; Shin, SangMyung; Kim, Youngsoon; Kim, Woojeong; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.1, pp.10 - 17, 2019-01

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