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Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging Yim, Myung Jin; Li, Yi; Moon, Kyoung-sik; Paik, Kyung-Wook; Wong, C. P., JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.22, no.14, pp.1593 - 1630, 2008 |
Template Dissolution Interfacial Patterning of Single Colloids for Nanoelectrochemistry and Nanosensing Lee, Joong Bum; Walker, Harriet; Li, Yi; Nam, Tae Won; Rakovich, Aliaksandra; Sapienza, Riccardo; Jung, Yeon Sik; et al, ACS NANO, v.14, no.12, pp.17693 - 17703, 2020-12 |
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