Browse "MS-Journal Papers(저널논문)" by Author Lee, YS
Showing results 1 to 6 of 6
| A comparative study on the Si precursors for the atomic layer deposition of silicon nitride thin films Lee, WJ; Lee, JH; Park, Chong-Ook; Lee, YS; Shin, SJ; Rha, SK, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.45, no.5, pp.1352 - 1355, 2004-11 |
| Characterization of TiN barriers against Cu diffusion by capacitance-voltage measurement Rha, SK; Lee, SY; Lee, WJ; Hwang, YS; Park, Chong-Ook; Kim, DW; Lee, YS; et al, JOURNAL OF VACUUM SCIENCE TECHNOLOGY B, v.16, no.4, pp.2019 - 2025, 1998-01 |
| Creep crack growth in brittle materials Jeon, JY; Lee, YS; Yu, Jin, INTERNATIONAL JOURNAL OF FRACTURE, v.101, no.3, pp.203 - 214, 2000-02 |
| Effect of matrix hardness on the creep properties of a 12CrMoVNb steel Lee, YS; Yu, Jin, METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.30, no.9, pp.2331 - 2339, 1999-09 |
| High strain rate superplasticity in powder metallurgy aluminium alloy 6061+20 vol.-%SiCp composite with relatively large particle size Kim, WJ; Lee, YS; Moon, SJ; Hong, Soon-Hyung, MATERIALS SCIENCE AND TECHNOLOGY, v.16, no.6, pp.675 - 680, 2000-06 |
| Texture and sheet resistance of Al alloy thin films on Ti and TiN thin films Lee, WJ; Kim, SJ; Lee, WH; Lee, YJ; Lee, YS; Rha, SK; Park, Chong-Ook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.15, no.1, pp.9 - 13, 2004-01 |
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