Browse "MS-Journal Papers(저널논문)" by Author Lee, TY
Showing results 1 to 8 of 8
| Analysis of phase transformation kinetics by intrinsic stress evolutions during the isothermal aging of amorphous Ni(P) and Sn/Ni(P) films Song, JY; Yu, Jin; Lee, TY, JOURNAL OF MATERIALS RESEARCH, v.19, no.4, pp.1257 - 1264, 2004-04 |
| Coating of tetraethylorthosilicate (TEOS) vinyltriethoxysilane (VTES) hybrid solution on polymer films Eo, YJ; Kim, DJ; Bae, Byeong-Soo; Song, KC; Lee, TY; Song, SW, JOURNAL OF SOL-GEL SCIENCE AND TECHNOLOGY, v.13, no.1-3, pp.409 - 413, 1998-11 |
| Effect of Aluminum Concentration on the Interfacial Reactions of Sn-3.0Ag-xAl Solders with Copper and ENIG Metallizations Xia, YH; Jee, YK; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.12, pp.1858 - 1862, 2008-12 |
| Effects of reactive diffusion on stress evolution in Cu-Sn films Song, JY; Yu, Jin; Lee, TY, SCRIPTA MATERIALIA, v.51, no.2, pp.167 - 170, 2004-07 |
| Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint Kim, SH; Kim, JY; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.9, pp.948 - 957, 2004-09 |
| Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, JOURNAL OF MATERIALS RESEARCH, v.19, no.8, pp.2428 - 2436, 2004-08 |
| Study on the Li and B co-doped diamond thin film Lee, WS; Yu, Jin; Lee, TY, JOURNAL OF MATERIALS SCIENCE, v.40, no.20, pp.5549 - 5551, 2005-10 |
| The effects of electroplating parameters on the composition and morphology of Sn-Ag solder Kim, JY; Yu, Jin; Lee, JH; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.12, pp.1459 - 1464, 2004-12 |
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