Browse "MS-Journal Papers(저널논문)" by Author Lee, Seyong
Showing results 1 to 5 of 5
| Effect of the Curing Properties and Viscosities of Nonconductive Films on the Solder Joint Morphology and Reliability of Chip-On-Board Packages Using Cu-Pillar/Sn-Ag Bumps Lee, Hanmin; Lee, Seyong; Choi, Taejin; Park, Sooin; Ko, Eun Kyoung; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.5, pp.924 - 928, 2020-05 |
| Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly Kim, Youngsoon; Lee, Seyong; Shin, Ji Won; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.45, no.6, pp.3208 - 3219, 2016-06 |
| Novel dielectric BN/epoxy nanocomposites with enhanced heat dissipation performance for electronic packaging Lee, Dongju; Lee, Seyong; Byun, Segi; Paik, Kyung-Wook; Song, Sung Ho, COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, v.107, pp.217 - 223, 2018-04 |
| The Effect of Double-Layer Nonconductive Films on the Solder Sidewall Wetting and the Reliability of 40-mu m Cu-Pillar/SnAg Microbumps for Chip-on-Chip Interconnection Lee, Seyong; Lee, Hanmin; Shin, SangMyung; Jang, MinGu; Choi, TaeJin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.6, pp.1167 - 1175, 2019-06 |
| Wafer-Level Double-Layer Nonconductive Films for Flip-Chip Assembly Lee, Seyong; Lee, HanMin; Shin, Ji Won; Kim, Woojeong; Choi, Taejin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1258 - 1264, 2017-08 |
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