Browse "MS-Journal Papers(저널논문)" by Author Lee, SeYong
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| Piezoelectric Ceramics and Flexible Printed Circuits' Interconnection Using Sn58Bi Solder Anisotropic Conductive Films for Flexible Ultrasound Transducer Assembly Park, Jae-Hyeong; Park, Jong Cheol; Lee, SeYong; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.9, pp.1897 - 1903, 2019-09 |
| The Effect of the Thermal Mechanical Properties of Nonconductive Films on the Thermal Cycle Reliability of 40-mu m Fine Pitch Cu-Pillar/Ni/SnAg Microbump Flip-Chip Assembly Lee, SeYong; Park, JongHo; Park, Jae-Hyeong; Lee, HanMin; Shin, SangMyung; Kim, Youngsoon; Kim, Woojeong; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.1, pp.10 - 17, 2019-01 |
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