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Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study Kwon, WS; Ham, SJ; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.46, no.2-4, pp.589 - 599, 2006 |
Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation Kwon, WS; Yim, MJ; Paik, Kyung-Wook; Ham, SJ; Lee, Soon-Bok, JOURNAL OF ELECTRONIC PACKAGING, v.127, pp.86 - 90, 2005-06 |
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