Browse "MS-Journal Papers(저널논문)" by Author Gam, SA

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Effects of Cu and Pd addition on au bonding wire/Al pad interfacial reactions and bond reliability

Gam, SA; Kim, HJ; Cho, JS; Park, YJ; Kim,SH; Moon, JT; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.35, pp.2048 - 2055, 2006-11

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