Browse "MS-Journal Papers(저널논문)" by Author Cho, S
Showing results 1 to 4 of 4
| Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition Kang, SK; Leonard, D; Shih, DY; Gignac, L; Henderson, DW; Cho, S; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.3, pp.479 - 485, 2006-03 |
| Oxidation study of pure tin and its alloys via electrochemical reduction analysis Cho, S; Yu, Jin; Kang, SK; Shih, DY, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.5, pp.635 - 642, 2005-05 |
| Surface modification effects of SiC tile on the wettability and interfacial bond strength of SiC tile/Al7075-SiCp hybrid composites Park, Jongbok; Lee, Junho; Jo, I; Cho, S; Lee, SK; Lee, SB; Ryu, Ho Jin; et al, SURFACE COATINGS TECHNOLOGY, v.307, pp.399 - 406, 2016-12 |
| The oxidation of lead-free Sn alloys by electrochemical reduction analysis Cho, S; Yu, Jin; Kang, SK; Shih, DY, JOM, v.57, no.6, pp.50 - 52, 2005-06 |
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