Browse "MS-Journal Papers(저널논문)" by Author Cho, Moon Gi
Showing results 1 to 15 of 15
| Comparison of Sn2.8Ag20In and Sn10Bi10In solders for intermediate-step soldering Seo, Sun-Kyoung; Cho, Moon Gi; Lee, HyuckMo; Choi, Won Kyoung, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.11, pp.1975 - 1981, 2006-11 |
| Crystal orientation of beta-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints Seo, Sun-Kyoung; Cho, Moon Gi; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.25, no.10, pp.1950 - 1957, 2010-10 |
| Effects of Be and Co addition on the growth of Sn whiskers and the properties of Sn-based Pb-free solders Chang, Jaewon; Seo, Sun-Kyoung; Cho, Moon Gi; Lee, Dong Nyung; Kang, Kyoo-Sik; Lee, Hyuck Mo, JOURNAL OF MATERIALS RESEARCH, v.27, no.14, pp.1877 - 1886, 2012-07 |
| Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM Kim, Dong Hoon; Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.1, pp.39 - 45, 2009-01 |
| Effects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates during thermal aging Cho, Moon Gi; Kang, Sung K.; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.36, no.11, pp.1501 - 1509, 2007-11 |
| Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders Cho, Moon Gi; Kang, Sung K.; Seo, Sun-Kyoung; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.24, no.2, pp.534 - 543, 2009-02 |
| Electromigration Performance of Pb-free Solder Joints in Terms of Solder Composition and Joining Path Seo, Sun-Kyoung; Kang, Sung K.; Cho, Moon Gi; Lee, HyuckMo, JOM, v.62, no.7, pp.22 - 29, 2010-07 |
| Enhancement of heterogeneous nucleation of beta-Sn phases in Sn-rich solders by adding minor alloying elements with hexagonal closed packed structures Cho, Moon Gi; Kim, Hyun You; Seo, Sun-Kyoung; Lee, HyuckMo, APPLIED PHYSICS LETTERS, v.95, no.2, pp.021905-1 - 021905-3, 2009-07 |
| Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging Cho, Moon Gi; Kang, Sung K.; Seo, Sun-Kyoung; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.11, pp.2242 - 2250, 2009-11 |
| Synthesis of the combination solder of 80Au-20Sn/42Sn-58Bi and thermodynamic interpretation of the microstructural evolution Yang, Chang Joon; Cho, Moon Gi; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.49, no.2, pp.376 - 381, 2008-02 |
| The Crystal Orientation of beta-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy Seo, Sun-Kyoung; Kang, Sung K.; Cho, Moon Gi; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.12, pp.2461 - 2469, 2009-12 |
| Thermodynamic assessment of the Ni-Bi binary system and phase equilibria of the Sn-Bi-Ni ternary system Seo, Sun-Kyoung; Cho, Moon Gi; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.36, no.11, pp.1536 - 1544, 2007-11 |
| Undercooling and microhardness of Pb-free solders on various under bump metallurgies Cho, Moon Gi; Kang, Sung K.; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.23, no.4, pp.1147 - 1154, 2008-04 |
| Undercooling, Microstructures and Hardness of Sn-Rich Pb-Free Solders on Cu-xZn Alloy Under Bump Metallurgies Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.50, no.9, pp.2291 - 2296, 2009-09 |
| Wettability and interfacial reactions of Sn-based Pb-free solders with Cu-xZn alloy under bump metallurgies Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ALLOYS AND COMPOUNDS, v.474, no.1-2, pp.510 - 516, 2009-04 |
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