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1
Effect of oxygen ion energy and annealing in formation of tin oxide thin films

Song, SK; Choi, WK; Cho, JS; Jung, HJ; Choi, D; Lee, JeongYong; Baik, HK; et al, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.36, no.4A, pp.2281 - 2287, 1997-04

2
Effects of Cu and Pd addition on au bonding wire/Al pad interfacial reactions and bond reliability

Gam, SA; Kim, HJ; Cho, JS; Park, YJ; Kim,SH; Moon, JT; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.35, pp.2048 - 2055, 2006-11

3
Effects of pd addition on au stud bumps/Al pads interfacial reactions and bond reliability

Kim, HJ; Cho, JS; Park, YJ; Lee, J; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.33, pp.1210 - 1218, 2004-10

4
Structure and gas-sensing characteristics of undoped tin oxide thin films fabricated by ion-assisted deposition

Song, SK; Cho, JS; Choi, WK; Jung, HJ; Choi, DS; Lee, JeongYong; Baik, HK; et al, SENSORS AND ACTUATORS B-CHEMICAL, v.46, no.1, pp.42 - 49, 1998-01

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