Browse "MS-Journal Papers(저널논문)" by Author Cho, HS
Showing results 1 to 5 of 5
| Characteristics of indium bump for flip-chip bonding used in polymeric-waveguide-integrated optical interconnection systems Chu, KM; Lee, JS; Cho, HS; Rho, BS; Park, HyoHoon; Jeon, DukYoung, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.43, no.8B, pp.5922 - 5927, 2004-08 |
| Effect of 1 at.% nitrogen addition on the creep resistance of two phase TiAl alloy Cho, HS; Nam, SW; Yun, JH; Wee, Dang-Moon, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.262, no.1-2, pp.129 - 136, 1999-04 |
| Microstructural lattice simulation and transient rheological behavior of a flow-aligning liquid crystalline polymer under low shear rates Cho, HS; Xu, MZ; Kim, Sang Ouk; Kim, KM; Chung, In Jae, KOREAN JOURNAL OF CHEMICAL ENGINEERING, v.18, no.1, pp.46 - 53, 2001-01 |
| Nitrogen-doped TiAl alloys - Part II - Plastic deformation behavior Yun, JH; Cho, HS; Nam, SW; Wee, Dang-Moon; Oh, MH, JOURNAL OF MATERIALS SCIENCE, v.35, no.18, pp.4533 - 4537, 2000-09 |
| Optoelectronic and microwave characteristics of silver coated indium bumps for low temperature flip-chip applications Chu, KM; Choi, JH; Lee, JS; Cho, HS; Park, SeongOok; Park, HyoHoon; Jeon, DukYoung, ELECTRONICS LETTERS, v.40, no.23, pp.1508 - 1509, 2004-11 |
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