Browse "MS-Journal Papers(저널논문)" by Author Cho, Byeong-Hoon
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| Effects of electroplating parameters on the defects of copper via for 3D SiP Cho, Byeong-Hoon; Lee, Won-Jong; Lee, Jae-Ho, DIFFUSION AND DEFECT DATA PT.B: SOLID STATE PHENOMENA, v.124-126, no.PART 1, pp.49 - 52, 2007-06 |
| Filling of very fine via holes for three-dimensional packaging by using ionized metal plasma sputtering and electroplating Cho, Byeong-Hoon; Yun, Jae-Jin; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS, v.46, no.45-49, pp.L1135 - L1137, 2007-12 |
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