Browse "MS-Journal Papers(저널논문)" by Author 김선운
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| Direct Wafer Bonding법에 의한 InP 기판과 Si₃N₄/InP의 접합특성 김선운; 신동석; 이정용; 최인훈, 한국재료학회지, v.8, no.10, pp.890 - 897, 1998-12 |
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