Browse "MS-Journal Papers(저널논문)" by Author 박영배
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| Cu/Cr/polyimide 계의 계면 파괴 에너지 박영배; 박익성; 유진, 대한금속·재료학회지, v.37, no.2, pp.238 - 243, 1999-01 |
| Numerical Analysis on the Die Pad/Epoxy Molding Compound(EMC) Interface Delaminationin Plastic Packages under Thermal and Vapor Pressure Holding 박영배; 유진, 마이크로전자 및 패키징학회지, v.5, no.2, pp.37 - 48, 1998-12 |
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