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Wear-mechanical properties of filler-added liquid silicon infiltration C/C-SiC composites Kim, Se Young; Han, In Sub; Woo, Sang Kuk; Lee, Kee Sung; Kim, Do Kyung, MATERIALS & DESIGN, v.44, pp.107 - 113, 2013-02 |
Wettability and interfacial reactions of Sn-based Pb-free solders with Cu-xZn alloy under bump metallurgies Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ALLOYS AND COMPOUNDS, v.474, no.1-2, pp.510 - 516, 2009-04 |
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