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Showing results 4 to 7 of 7

4
Residual stress effect on self-annealing of electroplated copper

Lee, CH; Park, Chong-Ook, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.42, no.7, pp.4484 - 4488, 2003-07

5
Residual stress measurements in electroless plated Ni-P films

Song, JY; Yu, Jin, THIN SOLID FILMS, v.415, no.1-2, pp.167 - 172, 2002-08

6
Strength versus ductility in carbon nanotube reinforced nickel matrix nanocomposites

Borkar, Tushar; Hwang, Jaewon; Hwang, Jun Yeon; Scharf, Thomas W.; Tiley, Jaimie; Hong, Soon Hyung; Banerjee, Rajarshi, JOURNAL OF MATERIALS RESEARCH, v.29, no.6, pp.761 - 769, 2014-03

7
The effect of stress on solid-phase epitaxial regrowth in As+-implanted two-dimensional amorphized Si

Shin, YG; Lee, JeongYong; Park, MH; Kang, HK, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.40, no.11, pp.6192 - 6197, 2001-11

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