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Preparation and characterization of Sn-3.0Ag-0.5Cu nano-solder paste and assessment of the reliability of joints fabricated by microwave hybrid heating Zhang, Shuai; Zhang, Shuye; Zhou, Hongzhi; Paik, Kyung-Wook; Ding, Tianran; Long, Weimin; Zhong, Sujuan; et al, MATERIALS CHARACTERIZATION, v.207, 2024-01 |
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