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Ultrasonic Bonding of Anisotropic Conductive Films Containing Ultrafine Solder Balls for High-Power and High-Reliability Flex-On-Board Assembly

Kim, Won-Chul; Lee, Ki-Won; Saarinen, Ilkka J.; Pykari, Lasse; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.5, pp.884 - 889, 2012-05

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