Browse "MS-Journal Papers(저널논문)" by Subject ultrasonic bonding
Showing results 3 to 4 of 4
Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers Zhang, Shuye; Yang, Ming; Jin, Ming Liang; Huang, Wen-Can; Lin, Tiesong; He, Peng; Lin, Panpan; et al, METALS, v.8, no.1, 2018-01 |
| Study on Fine Pitch Flex-on-Flex Assembly Using Nanofiber/Solder Anisotropic Conductive Film and Ultrasonic Bonding Method Lee, Sang-Hoon; Suk, Kyoung-Lim; Lee, Ki-Won; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.12, pp.2108 - 2114, 2012-12 |
Discover
Open Access
- 265 OA Article
Date issued
- 1,073 2020 - 2024
- 2,625 2010 - 2019
- 2,168 2000 - 2009
- 1,240 1990 - 1999
- 179 1980 - 1989