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Novel dielectric BN/epoxy nanocomposites with enhanced heat dissipation performance for electronic packaging Lee, Dongju; Lee, Seyong; Byun, Segi; Paik, Kyung-Wook; Song, Sung Ho, COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, v.107, pp.217 - 223, 2018-04 |
Strengthening effect of melamine functionalized low-dimension carbon at fiber reinforced polymer composites and their interlaminar shear behavior Cha, Jaemin; Kim, Joon Hui; Ryu, Seongwoo; Hong, Soon H., COMPOSITES PART B-ENGINEERING, v.173, 2019-09 |
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