Showing results 12 to 14 of 14
Reflow of copper in an oxygen ambient Lee, SY; Kim, DW; Rha, SK; Park, Chong-Ook; Park, HH, JOURNAL OF VACUUM SCIENCE TECHNOLOGY B, v.16, no.5, pp.2902 - 2905, 1998-01 |
Structural and chemical stability of Ta-Si-N thin film between Si and Cu Lee, YJ; Suh, BS; Rha, SK; Park, Chong-Ook, THIN SOLID FILMS, v.320, no.1, pp.141 - 146, 1998-05 |
Texture and sheet resistance of Al alloy thin films on Ti and TiN thin films Lee, WJ; Kim, SJ; Lee, WH; Lee, YJ; Lee, YS; Rha, SK; Park, Chong-Ook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.15, no.1, pp.9 - 13, 2004-01 |
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