Showing results 4 to 7 of 7
Oxidation study of pure tin and its alloys via electrochemical reduction analysis Cho, S; Yu, Jin; Kang, SK; Shih, DY, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.5, pp.635 - 642, 2005-05 |
Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, JOURNAL OF MATERIALS RESEARCH, v.19, no.8, pp.2428 - 2436, 2004-08 |
Study of the reaction mechanism between electroless Ni-P and Sn and its effect on the crystallization of Ni-P Sohn, YC; Yu, Jin; Kang, SK; Choi, WK; Shih, DY, JOURNAL OF MATERIALS RESEARCH, v.18, no.1, pp.4 - 7, 2003-01 |
The oxidation of lead-free Sn alloys by electrochemical reduction analysis Cho, S; Yu, Jin; Kang, SK; Shih, DY, JOM, v.57, no.6, pp.50 - 52, 2005-06 |
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