Browse "MS-Journal Papers(저널논문)" by Subject FAILURE
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| Kinetics of electromigration-induced edge drift in Al-Cu thin-film interconnects Morris Jr. J.W.; Kim C.U.; Lee, HyuckMo, JOURNAL OF APPLIED PHYSICS, v.82, no.4, pp.1592 - 1598, 1997 |
| Shear strength of Sn-3.5Ag solder bumps formed on Ni/Au and organic solderability preservative surface-finished bond pads after multiple reflow steps Lee, JS; Chu, KM; Jeon, DukYoung, JOURNAL OF MATERIALS RESEARCH, v.20, no.11, pp.3088 - 3093, 2005-11 |
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