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Interfacial microstructure of diffusion-bonded SiC and Re with Ti interlayer Kim, Joo-Hyung; Kim, Dong-Seok; Lim, Seong Taek; Kim, Do Kyung, JOURNAL OF ALLOYS AND COMPOUNDS, v.701, pp.316 - 320, 2017-04 |
Interfacial microstructure of diffusion-bonded W-25Re/Ti/graphite joint and its high-temperature stability Kim, Joo-Hyung; Baek, Changyeon; Kim, Dong Seok; Lim, Seong Taek; Kim, Do Kyung, Korean Journal of Materials Research, v.26, no.12, pp.751 - 756, 2016-12 |
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