Browse "MS-Journal Papers(저널논문)" by Author Rha, SK
Showing results 8 to 14 of 14
| Grain growth of copper films prepared by chemical vapour deposition Rha, SK; Lee, WJ; Lee, SY; Kim, DW; Park, Chong-Ook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.8, no.4, pp.217 - 221, 1997-08 |
| Improved TiN film as a diffusion barrier between copper and silicon Rha, SK; Lee, WJ; Lee, SY; Hwang, YS; Lee, YJ; Kim, DI; Kim, DW; et al, THIN SOLID FILMS, v.320, no.1, pp.134 - 140, 1998-05 |
| Interdiffusions and reactions in Cu/TiN/Ti/Si and Cu/TiN/Ti/SiO2/Si multilayer structures Rha, SK; Lee, WJ; Lee, SY; Kim, DW; Park, Chong-Ook; Chun, SS, JOURNAL OF MATERIALS RESEARCH, v.12, no.12, pp.3367 - 3372, 1997-12 |
| Investigation of silicon oxide thin films prepared by atomic layer deposition using SiH2Cl2 and O-3 as the precursors Lee, JH; Kim, UJ; Han, CH; Rha, SK; Lee, WJ; Park, Chong-Ook, JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, v.43, no.3A, pp.L328 - L330, 2004-03 |
| Reflow of copper in an oxygen ambient Lee, SY; Kim, DW; Rha, SK; Park, Chong-Ook; Park, HH, JOURNAL OF VACUUM SCIENCE TECHNOLOGY B, v.16, no.5, pp.2902 - 2905, 1998-01 |
| Structural and chemical stability of Ta-Si-N thin film between Si and Cu Lee, YJ; Suh, BS; Rha, SK; Park, Chong-Ook, THIN SOLID FILMS, v.320, no.1, pp.141 - 146, 1998-05 |
| Texture and sheet resistance of Al alloy thin films on Ti and TiN thin films Lee, WJ; Kim, SJ; Lee, WH; Lee, YJ; Lee, YS; Rha, SK; Park, Chong-Ook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.15, no.1, pp.9 - 13, 2004-01 |
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