Browse "MS-Journal Papers(저널논문)" by Author Reichl, H

Showing results 3 to 5 of 5

3
Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy

Jeon, YD; Paik, Kyung-Wook; Ostmann, A; Reichl, H, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.80 - 90, 2005-01

4
Pb-free Sn/3.5Ag electroplating bumping process and under bump metallization (UBM)

Jang, Se-Young; Wolf, J; Ehrmann, O; Gloor, H; Reichl, H; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.25, no.3, pp.193 - 202, 2002-07

5
Pb-free Sn/3.5Ag wafer-bumping process and UBM (under bump metallurgy) study

Jang, SY; Wolf, J; Ehrmann, O; Reichl, H; Paik, Kyung-Wook, MICROSYSTEM TECHNOLOGIES, v.7, no.5-6, pp.269 - 272, 2002-01

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