Showing results 2 to 3 of 3
Characterization of small-sized eutectic Sn-Bi solder bumps fabricated using electroplating Jung, HR; Kim, HH; Lee, Won-Jong, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.5, pp.1067 - 1073, 2006-05 |
Oxidation, grain growth and reflow characteristics of copper thin films prepared by chemical vapor deposition Lee, SY; Choi, SH; Park, Chong-Ook, THIN SOLID FILMS, v.359, no.2, pp.261 - 267, 2000-01 |
Discover