Browse "MS-Journal Papers(저널논문)" by Subject non-conductive-film
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| Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly Kim, Youngsoon; Lee, Seyong; Shin, Ji Won; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.45, no.6, pp.3208 - 3219, 2016-06 |
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