Browse "MS-Journal Papers(저널논문)" by Title
Showing results 2921 to 2940 of 7234
| Flexible Protective Film: Ultrahard, Yet Flexible Hybrid Nanocomposite Reinforced by 3D Inorganic Nanoshell Structures Bae, Gwangmin; Choi, Gwang-Mun; Ahn, Changui; Kim, Sang-Min; Kim, Wonsik; Choi, Youngjun; Park, Dawon; et al, ADVANCED FUNCTIONAL MATERIALS, v.31, no.18, pp.2010254, 2021-05 |
| Flexible Resistive Switching Memory Device Based on Graphene Oxide Hong, Seul Ki; Kim, Ji Eun; Kim, Sang Ouk; Choi, Sung-Yool; Cho, Byung Jin, IEEE ELECTRON DEVICE LETTERS, v.31, no.9, pp.1005 - 1007, 2010-09 |
| Flexible room-temperature NO2 gas sensors based on carbon nanotubes/reduced graphene hybrid films Jeong, Hu Young; Lee, Dae-Sik; Choi, Hong Kyw; Lee, Duck Hyun; Kim, Ji-Eun; Lee, JeongYong; Lee, Won-Jong; et al, APPLIED PHYSICS LETTERS, v.96, no.21, 2010-05 |
| Flexible Self-Charging, Ultrafast, High-Power-Density Ceramic Capacitor System Peddigari, Mahesh; Park, Jung Hwan; Han, Jae Hyun; Jeong, Chang Kyu; Jang, Jongmoon; Min, Yuho; Kim, Jong-Woo; et al, ACS ENERGY LETTERS, v.6, no.4, pp.1383 - 1391, 2021-04 |
| Flexible temperature sensors made of aligned electrospun carbon nanofiber films with outstanding sensitivity and selectivity towards temperature Lee, Jeng-Hun; Chen, Haomin; Kim, Eunyoung; Zhang, Heng; Wu, Ke; Zhang, Hongming; Shen, Xi; et al, MATERIALS HORIZONS, v.8, no.5, pp.1488 - 1498, 2021-05 |
| Flexible thermoelectric films with high power factor made of non-oxidized graphene flakes Novak, Travis G.; Kim, Jin; Kim, Jungmo; Shin, Hosun; Tiwari, Anand P.; Song, Jae Yong; Jeon, Seokwoo, 2D MATERIALS, v.6, no.4, 2019-10 |
| Flexible transparent conducting composite films using a monolithically embedded AgNW electrode with robust performance stability Im, Hyeon-Gyun; Jin, Jungho; Ko, Ji-Hoon; Lee, Jae Min; Lee, Jung-Yong; Bae, Byeong-Soo, Nanoscale, v.6, no.2, pp.711 - 715, 2014-01 |
| Flexible Transparent Conducting Hybrid Film Using a Surface-Embedded Copper Nanowire Network: A Highly Oxidation-Resistant Copper Nanowire Electrode for Flexible Optoelectronics Im, Hyeon-Gyun; Jung, Soo-Ho; Jin, Jungho; Lee, Dasom; Lee, Jae Min; Lee, Daewon; Lee, Jung-Yong; et al, ACS Nano, v.8, no.10, pp.10973 - 10979, 2014-10 |
| Flexible Transparent Conductive Films with High Performance and Reliability Using Hybrid Structures of Continuous Metal Nanofiber Networks for Flexible Optoelectronics Park, Juyoung; Hyun, Byung Gwan; An, Byeong Wan; Im, Hyeon-Gyun; Park, Young-Geun; Jang, Junho; Park, Jang-Ung; et al, ACS APPLIED MATERIALS & INTERFACES, v.9, no.24, pp.20299 - 20305, 2017-06 |
| Flexible wireless powered drug delivery system for targeted administration on cerebral cortex Sung, Sang Hyun; Kim, Young Soo; Joe, Daniel Juhyung; Mun, Beomho; You, Byoung Kuk; Keum, Do Hee; Hahn, Sei Kwang; et al, NANO ENERGY, v.51, pp.102 - 112, 2018-09 |
| Flexural strength and dielectric properties of in-situ Si3N4-SiO2-BN composite ceramics Lee, Hyun Min; Lee, Seung Jun; Baek, Seungsu; Kim, Do-Kyung, JOURNAL OF THE KOREAN CERAMIC SOCIETY, v.51, no.5, pp.386 - 391, 2014-09 |
| Fliessvermoegen und Warmrissverhalten von Blei-Antimon-Legierungen,Part I:Fliessvermoegen(Fluidity) S. Engler; Zin-Hyoung Lee, GIESSEREI, v.30, pp.107 - 116, 1978 |
| Fliessvermoegen und Warmrissverhalten von Blei-ANTIMON-Legierungen,Part II:Warmrissverhalten(Hot Tearing Behavior S. Engler; Zin-Hyoung Lee, GIESSEREI, v.30, pp.116 - 120, 1978 |
| Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity 임명진; 김형준; 백경욱, 마이크로전자 및 패키징학회지, v.12, no.1, pp.9 - 16, 2005-03 |
| Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications Yim, MJ; Jeong, IH; Choi, HK; Hwang, JS; Ahn, JY; Kwon, W; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.28, pp.789 - 796, 2005-12 |
| Flip Chip on Organic Board Technology using Modified Anisotropic Conductive Films and Electroless Nickel/Gold Bump 백경욱; 임명진; 전영두, 한국마이크로전자 및 패키징학회지, v.6, no.2, pp.13 - 21, 1999-06 |
| Flip Chip 접속을 위한 무전해 니켈 범프의 형성 및 특성 연구 전영두; 임명진; 백경욱, 한국재료학회지, v.9, no.11, pp.1095 - 1101, 1999-11 |
| Flip-chip bonding of MEMS scanner for laser display using electroplated AuSn solder bump Chu, KM; Choi, WK; Ko, YC; Lee, JH; Park, HyoHoon; Jeon, DukYoung, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.1, pp.27 - 33, 2007-02 |
| Floating phenomenon of layered basic zinc acetate structures on patterned silicon substrates: Aging and concentration effects Ahn, H. B.; Kim, Y. H.; Lee, JeongYong, MATERIALS LETTERS, v.75, pp.8 - 11, 2012-05 |
| Flow softening behavior during high temperature deformation of Ti-48Al-2W intermetallic compound Kim, HY; Hong, Soon-Hyung, METALS AND MATERIALS-KOREA, v.4, no.4, pp.765 - 770, 1998-01 |
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