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Grain-dependent passivation of surfaces of polycrystalline zinc Park, CJ; Lohrengel, MM; Hamelmann, T; Pilaski, M; Kwon, Hyuk-Sang, ELECTROCHIMICA ACTA, v.47, no.21, pp.3395 - 3399, 2002-08 |
Study on the effects of copper oxide growth on the peel strength of copper/polyimide Lee, Hyuek Jae; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.8, pp.1102 - 1110, 2008-08 |
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