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Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging Cho, Moon Gi; Kang, Sung K.; Seo, Sun-Kyoung; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.11, pp.2242 - 2250, 2009-11 |
Transformation mechanisms from metallic Zn nanocrystals to insulating ZnSiO(3) nanocrystals in a SiO(2) matrix due to thermal treatment Yuk, Jong Min; Lee, Jeong-Yong; No, Y. S.; Kim, T. W.; Choi, W. K., APPLIED PHYSICS LETTERS, v.93, no.22, 2008-12 |
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