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공태영; 류호진; 홍순형, 한국분말재료학회 2023 추계학술발표회, 2023-12-01
Ko, JiWoo; Jung, Yeon Sik, 2023 MRS Fall Meeting & Exhibit, 2023-12-01
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Analysis of Phase Structure of Al-Al3(Ti,V,Zr) Composite Alloy Prepared by Vacuum Arc Melting Lee, Hyuck Mo; Han, SZ, Second Pacific Rim International Conference on Advanced Materials and Processing(PRICM-2), pp.2501 - 2506, 1995-06-18 |
Compositional Effect on Phase Stability and Hardness of Al66Mn9(Ti,Zr)25 Intermetallic Compounds Lee, Hyuck Mo; Han, SZ; Rho, BS, Second Pacific Rim International Conference on Advanced Materials and Processing, pp.2477 - 2482, 1995-06-18 |
Study on the Tempering of Ultrahigh-Strength and High-Toughness AerMet100 Steel Lee, Hyuck Mo; Yoo, CH, Second Pacific Rim International Conference on Advanced Materials and Processing(PRICM-2), pp.2013 - 2018, 1995-06-18 |
Development of Uranium-Silicide and U-Mo Alloy Fuels by Centruifugal Atomization Paik, Kyung-Wook, Technical Committee on Research fo Fuel Aimed by Low Fission Gas Release, pp.0 - 0, 1996-10-01 |
Chromium Aluminim Oxide Phase-Shifting Mask Material for 193nm Lithography No, Kwangsoo; Kim, Eun Ah; Hong, Seung Bum; Moon, Seong-Yong, Third International Symposium on 193nm Lithography, pp.127 -, 1997 |
Heteroepitaxial growth of diamond films Synthesized by Microwave Plasma Enhanced Chemical Vapor Deposition Lee, Jai Young, International Diamond Symposium, 1996 |
Low-Cost & High-Reliability MCM-D Substrate Unit Process Development Paik, Kyung-Wook, International Conference on Electronic Materials, pp.96 - 96, 1998-03-01 |
Anisotropic Conductive Films with Area-arrayed Conducting Microbumps Paik, Kyung-Wook, International Conference on Electronic Materials, pp.139 - 139, 1998-03-01 |
Analytical Model for Thermal Expansion Composites in Building Construction Hong, Soon-Hyung, 177, 1996-01-01 |
Interfacial Studies on the Electroplated Eutectic Pb/Sn Flip-Chip Solder Bump and UBM (Under Bump Metallurgy) Paik, Kyung-Wook, International Conference on Electronic Materials, pp.0 - 0, 1998-05-01 |
Eutectic Pb/Sn Solder Bump and Under Bump Metallurgy(UBM) Interfacial Reaction and Adhesion Paik, Kyung-Wook, 2nd electronic Packaging Technology Conference, pp.69 - 75, 1998-03-01 |
Analysis on the Passive Films of Fe, Cr and Fe-25Cr Alloy by Photo-Electrochemical Methods Kwon, Hyuk-Sang, , 1997-01-01 |
Dynamic Strain Aging Behavior of Inconel 600 Alloy Hong, Soon-Hyung, 401, 1996-01-01 |
Mechanical Properties and Failure Mechanism of Honeycomb Composites Hong, Soon-Hyung, 397, 1996-01-01 |
크롬 도금조건이 전주(電鑄)된 구리도금층의 박리에 미치는 영향 연구, 한국표면공학회 추계 학술발표회 권혁상; 김상범, 한국표면공학회 추계학술발표회, 한국표면공학회, 1998 |
475 ℃ 시효처리된 초이상 스테인리스강의 기계적 성질과 부식특성에 미치는 Mo와 W의 역할 권혁상; 박찬진, 한국부식학회 추계학술발표회, 1998 |
전기화학기법에 의한 증기발생기 세관의 입계응력부식에 대한 안정성 평가기술 개발 권혁상; 김수정, 한국부식학회 추계학술발표회, 한국부식학회, 1998 |
인가응력이 스테인리스강의 재부동태 거동에 미치는 영향, 한국부식학회 춘계 학술발표회 권혁상; 조은애, 한국부식학회 춘계학술발표회, 한국부식학회, 1998 |
Synthesis of Monodispersed Spherical Si3N4/SiC Composite Powder from Alkoxides by Sol-Gel Process and Heat-treatment Kim, Do Kyung, Proceeding of Ceramic Matrix Composites Symposium, 1996 |
Coating and Reactions of TEOS/VTES Sol-Gel Solution Bae, Byeong-Soo; Eo, YJ; Han, SS; Kim, DJ; Song, KC; Chung, KS, MRS 1997 Spring Meeting, 1997 |
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