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Results 31-40 of 250 (Search time: 0.004 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
31
Assembly yield enhancement of electroless Ni-P UBM/Pb-free solder joints

Kwon, YM; Jeon, YD; Paik, Kyung-Wook; Kim, JD; Lee, JW, 7th Electronics Packaging Technology Conference, EPTC 2005, v.1, pp.287 - 291, 2005-12-07

32
Study on Coined Solder Bumps on PCB Pads

Paik, Kyung-Wook; Nah, JW; Kim, WH; Hur, KR, Proceedings of the 7th Pan Pacific Microelectronics Symposium, pp.79 - 85, 2002-02

33
Low Tolerance Epoxy/BaTiO3 Composite Embedded Capacitor Films(ECFs)

Paik, Kyung-Wook; Cho, SD; Lee, JY; Hyun, JG, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2002, pp.341 - 347, 2002-12

34
Comparison of Ni-filled Balls and Au-coated Polymer Balls in High-frequency Application of ACF flip-chip Joint

Paik, Kyung-Wook; Ahn, Seung Young; Rhu, Woong Hwan; Yim, Myung-Jin; Lee, Jun Ho; Jeon, Young-Doo; Kim, Woo Poung; Kim, Joung Ho, APACK'99 Symposium on Advances in Packaging, pp.353 - 356, 1999-12-01

35
Anisotropic Conductive Film for Fine Pitch COG (Chip-on-Glass) Technology Application

Yim, MJ; Kwon, WS; Paik, Kyung-Wook, The 5th Korea-Japan International Symposium on Liquid Crystalline Materials and Devices, pp.64 - 65, 2001-05-01

36
Novel 3-Dimensional Memory Stack Package Using Polymer Insulated Sidewall

Paik, Kyung-Wook, International Conference on Electronic Materials, pp.97 - 97, 1998-03-01

37
Effects of BaTiO3 Composite Films and Pastes for High Dielectric Constant and Low Tolerance Embedded Capacitor Fabrication in Organic Substrates

Cho, Sung-Dong; Jang, Kyung-Woon; Hyun, Jin-Gul; Paik, Kyung-Wook, 2004 Pan Pacific Microelectronics, pp.109 - 115, 2004

38
The Effect of Alumina powder filled Polyimide Adhesive on the Thermo-Mechanical Stress of Lead-On-Chip Package

Paik, Kyung-Wook, 3rd Pan Pacific Microelectronics Sym., pp.429 - 434, 1998-02-01

39
Reliable Anisotropic Conductive Adhesives Flip Chip Technology on Organic Substrates for High Frequency Applications

Paik, Kyung-Wook; Yim, MJ; Kwon, WS, The 6th International Symposium on Microelectronics and Packaging, pp.0 - 0, 2001-04-01

40
Low temperature processing for integrated magnetics

Lok, BK; Paik, Kyung-Wook; Wai, LL; Fan, W; Lu, ACW; Pramoda, KP, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0 - 0, 2007-11-19

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