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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Oxygen Reactive Ion Beam Etching on Polyimide to Enhance Copper Film Adhesion Paik, Kyung-Wook, Proc. Mat. Res. Soc. Symp, pp.271 - 276, 1988-03-01 | |
| Development of New Ion Beam Modification Techniques to Enhance Copper and Polyimide Adhesion in Multilevel Electronic Packaging Paik, Kyung-Wook, Proc. Mat. Res. Soc. Symp, pp.21 - 26, 1989-03-01 | |
| RBS Studies on Ti, Ni and Zr Diffusion in Polyimide Paik, Kyung-Wook, Proc. Mat. Res. Soc. Symp, pp.143 - 148, 1989-02-01 | |
| Surface Morphological Changes of PI with Oxygen Reactive Ion Beam Etching(RIBE) Paik, Kyung-Wook, Proc. Mat. Res. Soc. Symp, pp.495 - 500, 1989-01-01 |
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