Browse "MS-Conference Papers(학술회의논문)" by Author Zhang, Shang
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| Effects of the citrate-coated nanosized Ag pastes on joining reliable Cu-Cu joints for Current 3D ICs Zhang, Shuye; Duan, Xiaokang; Li, Zhenfeng; Xu, Jiaohao; Wang, Dayin; Zhang, Shang; He, Peng; et al, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), pp.1957 - 1962, IEEE, 2021-06 |
| Reliability analysis of 3D CSP MEMS and IC under thermal cycle-impact coupled multi-physics loads Zhang, Shuye; Xu, Jianhao; Zhang, Shang; He, Peng; Sun, Mingjia; Yang, Jianqun; Li, Xingji; et al, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), IEEE, 2021-06 |
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