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A comparative study of ENIG and Cu OSP surface finishes on the mechanical reliability of Sn-3.0Ag-0.5Cu and Sn-36.8Pb-0.4Ag solders

Jee, YK; Sohn, YC; Yu, Jin; Lee, TY; Seo, HN; Kim, KH; Ahn, JH; et al, 2006 International Conference on Electronic Materials and Packaging, EMAP, pp.571 - 579, 2006-12-11

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