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Interface Adhesion Effect of Anchoring Polymer Layer Anisotropic Conductive Films on the Bending Reliability for Ultra-fine Pitch Wearable Chip-on-Flex Packages

Pan, Yan; Peng, Xiaohui; Zhu, Pengli; Sun, Rong; Paik, Kyung-Wook, 23rd International Conference on Electronic Packaging Technology, ICEPT 2022, Institute of Electrical and Electronics Engineers Inc., 2022-08

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