Browse "MS-Conference Papers(학술회의논문)" by Type Conference

Showing results 5021 to 5040 of 7308

5021
Relaxation of Crack Tip Stresses by Diffusive Growth of Frain Boundary Cavities

Yu, Jin; Jeon, JY, Proc. 5th Int. Conf. Strength of Materials(ICSMA-5), (The Japan Institute of Metals), pp.611 - 614, 1994-06-01

5022
Relaxation of phosphor screen characteristics of low voltage CL display devices

Jeon, Duk Young, pp.489 -, 2002-01-29

5023
Relaxation of remanent polarization in PZT thin film capacitors

Lee, Won-Jong, ISAF XIII, ISIF XIV, FMA XIX, pp.372 - 372, 2002-05-01

5024
Relaxation of remnant polarization in PZT thin film capacitors

Lee, Won-Jong; Lee, KW, International Joint Conference on the Applications of Ferroelectrics 2002, 2002-05-28

5025
Relaxing Interfacial Dipole by Inducing PEDOT:PSS in Colloidal Quantum Dot Photovoltaics to Improve Efficiency

Lim, Hunhee; Jung, Yeon Sik, 2016 IUPAC-PSK40, 한국고분자학회, 2016-10-06

5026
Release of Trapped electrons and Related Charge Transport Properties in Al-Doped ZnO-Multi-Wall Carbon Nanotube Nanocomposite

Lee, JeongYong; Nam, WH; Kim, BB; Seo, SG; Lim, YS; Seo, WS; Park, HH, 2013 Materials Research Society Fall Meeting, Materials Research Society, 2013-12-02

5027
Reliability analysis of 3D CSP MEMS and IC under thermal cycle-impact coupled multi-physics loads

Zhang, Shuye; Xu, Jianhao; Zhang, Shang; He, Peng; Sun, Mingjia; Yang, Jianqun; Li, Xingji; et al, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), IEEE, 2021-06

5028
Reliability Characteristics of the Thin Interlevel Poly Silicon Oxide for EEPROM Device

Sang-Won Kang, ESC, Extended Abstract, pp.241 -, 1987

5029
Reliability enhancement of embedded capacitors in printed circuit boards using b-stage epoxy/batio3 composite embedded capacitor films (ECFS)

Lee, S; Jang, JM; Lee, WS; Paik, Kyung-Wook, 2009 59th Electronic Components and Technology Conference, ECTC 2009, pp.771 - 776, 2009-05-26

5030
Reliability Improvement Methods of Solder Anisotropic Conductive Film (ACF) Joints Using Morphology Control of Solder ACF Joints

Kim, Yoo-Sun; Kim, Seung-Ho; Shin, Ji-Won; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-29

5031
Reliability Improvement of Solder Anisotropic Conductive Film (ACF) Joints by Controlling ACF Polymer Resin Properties

Kim, Yoo-Sun; Kim, Seung-Ho; Shin, Jiwon; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-27

5032
Reliability Studies on GE High Density Interconnect(HDI) Modules

Paik, Kyung-Wook, Proc. Mat. Res. Soc. Symp, pp.71 - 76, MRS, 1994-03-01

5033
Reliable Anisotropic Conductive Adhesives Flip Chip Technology on Organic Substrates for High Frequency Applications

Paik, Kyung-Wook; Yim, MJ; Kwon, WS, The 6th International Symposium on Microelectronics and Packaging, pp.0 - 0, 2001-04-01

5034
Reliable artificial leaky integrate and fire (LIF) neuron device using 2D material

Ahn, Wonbae; Ham, Ayoung; Oh, Jungyeop; Kang, Kibum; Choi, Sung-Yool, The 12th International Workshop on 2D Materials (A3 Workshop), Nanjing university, 2023-07-20

5035
Reliable Memristive Switching Behavior Directed by Locally-Concentrated Electric Field from Densely-Packed Silver Nanocone Arrays

You, Byoung Kuk; Lee, Keon Jae, 2016년도 한국재료학회 추계학술대회, 사단법인 한국재료학회, 2016-11-17

5036
Remarkable Rate Capability and Cycling Stability of Li-Sulfur Battery with Tin Sulfide Modified Separator

Moorthy, Brindha; 권순호; 김주형; Ragupathy, P; 이혁모; 김도경, 2019년 한국세라믹학회 춘계학술대회, 한국세라믹학회, 2019-04-11

5037
Repassivation Kinetics and Stress Corrosion, resistance and Phase transformations of 14Cr-3Mo martensitic stainless steels

권혁상, 한국부식방식학회 추계학술대회, pp.0 - 0, 한국부식방식학회, 2005-11-01

5038
Repassivation Kinetics of Fe-20Cr-xNi Alloys (x = 0∼80 wt%) and Its Relation to Stress Corrosion Susceptibility

Cho, Eun-Ae; Kwon, HS., Asian-Pacific Corrosion Control Conference , Asian-Pacific Corrosion Control Conference, 2001-10-07

5039
Repassivation kinetics of Fe-20Cr-xNi alloys (x=0~80 wt%) and its relation to stress corrosion susceptibility

Kwon, Hyuk-Sang; Cho, Eun Ae, Asian-Pacific Corrosion Control Conference, 2001

5040
Repassivation kinetics of Fe-20Cr-xNi alloys (x=0~80%) and Its relationship with stress corrosion susceptibility

Kwon, Hyuk-Sang; Cho, Eun Ae, international meeting of the electrochemical society, ECS, 2001

rss_1.0 rss_2.0 atom_1.0