| 5021 | Relationship between Elastic Modulus and Texture of Gold Bonding Wire for Electronic Packaging Applications Hong, Soon Hyung, pp.15 - 22, 2001-01-01 |
| 5022 | Relationship between elastic properties and acoustic properties of EPDM rubber composites for underwater acoustic sensors Hong, Soon Hyung, pp.1 - 4, 2002-01-01 |
| 5023 | Relationship between Hydrogen-Assisted Crack Propagation and Fracture Mode in AISI 4340 Steel 변수일, Korean Corros. Sci. Soc., pp.6 - 6, 1989 |
| 5024 | Relationship between interface and peel strength of Cu-Ni clads prepared by surface activated bonding Hong, Soon-Hyung, NANO KOREA 2010, 2010-08-17 |
| 5025 | Relationship between Interfacial Reaction and Adhesion at the PVD TiO2 Film/Metal(Ti or Al) Interface Pyun, Su Il, Intern.Conf. on Met.Coatings and Thin Films, 1993 |
| 5026 | Relationship between Mechanical Properties and Microstructure of Nannocrystalline Gold Bonding Wires Kim, Kyung Seop; Song, Jiyoung; Chung, EK; Pakr, JK; Hong, Soon Hyung, International Symposium on Macro-, Meso-, Micro- and Nano-Mechanics of Materials, pp.167 - 169, International Symposium on Macro-, Meso-, Micro- and Nano-Mechanics of Materials, 2003-12-08 |
| 5027 | Relationship between mechanical properties and microstructure of ultra-fine wires 홍순형; Kim, KS; Park, HJ; Na, KH, 4th Workshop on Milli-structure Manufacturing Technology, pp.16 - 21, 2003 |
| 5028 | Relationship between mechanical properties and microstructure of ultra-fine wires Hong, Soon-Hyung; Kim, KS; Park, HJ; Na, NH, 4th Korea-Japan Joint Symposium on Micro-Fabrication, pp.45 - 50, 2003-05-01 |
| 5029 | Relationship between the Preferred Orientation and Morphology of Pb-Sn-Cu Alloy Electrodeposits 변수일, Korean Corros. Sci. Soc., pp.8 - 8, 1988 |
| 5030 | Relationships between suspension formulations and the properties of BaTiO3/epoxy composite films for integral capacitors Cho, SD; Paik, Kyung-Wook, 51st 2001 Electronic Components and Technology Conference, pp.1418 - 1422, IEEE, 2001-05-29 |
| 5031 | Relativistic Motion of Antiferromagnetic Domain Walls Driven by Spin-orbit Torques", 2016 Spring Conference of the Korean Institute of Metals and Materials Shiino, T; 오세혁; 박병국; 이경진, 2016 대한금속재료학회 춘계학술대회, 대한금속재료학회, 2016-04-27 |
| 5032 | Relaxation of Crack Tip Stresses by Diffusive Growth of Frain Boundary Cavities Yu, Jin; Jeon, JY, Proc. 5th Int. Conf. Strength of Materials(ICSMA-5), (The Japan Institute of Metals), pp.611 - 614, 1994-06-01 |
| 5033 | Relaxation of phosphor screen characteristics of low voltage CL display devices Jeon, Duk Young, pp.489 -, 2002-01-29 |
| 5034 | Relaxation of remanent polarization in PZT thin film capacitors Lee, Won-Jong, ISAF XIII, ISIF XIV, FMA XIX, pp.372 - 372, 2002-05-01 |
| 5035 | Relaxation of remnant polarization in PZT thin film capacitors Lee, Won-Jong; Lee, KW, International Joint Conference on the Applications of Ferroelectrics 2002, 2002-05-28 |
| 5036 | Relaxing Interfacial Dipole by Inducing PEDOT:PSS in Colloidal Quantum Dot Photovoltaics to Improve Efficiency Lim, Hunhee; Jung, Yeon Sik, 2016 IUPAC-PSK40, 한국고분자학회, 2016-10-06 |
| 5037 | Release of Trapped electrons and Related Charge Transport Properties in Al-Doped ZnO-Multi-Wall Carbon Nanotube Nanocomposite Lee, JeongYong; Nam, WH; Kim, BB; Seo, SG; Lim, YS; Seo, WS; Park, HH, 2013 Materials Research Society Fall Meeting, Materials Research Society, 2013-12-02 |
| 5038 | Reliability analysis of 3D CSP MEMS and IC under thermal cycle-impact coupled multi-physics loads Zhang, Shuye; Xu, Jianhao; Zhang, Shang; He, Peng; Sun, Mingjia; Yang, Jianqun; Li, Xingji; et al, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), IEEE, 2021-06 |
| 5039 | Reliability Characteristics of the Thin Interlevel Poly Silicon Oxide for EEPROM Device Sang-Won Kang, ESC, Extended Abstract, pp.241 -, 1987 |
| 5040 | Reliability enhancement of embedded capacitors in printed circuit boards using b-stage epoxy/batio3 composite embedded capacitor films (ECFS) Lee, S; Jang, JM; Lee, WS; Paik, Kyung-Wook, 2009 59th Electronic Components and Technology Conference, ECTC 2009, pp.771 - 776, 2009-05-26 |
