Results 1-10 of 16 (Search time: 0.007 seconds).
NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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A soft-imprint technique for direct fabrication of submicron scale patterns using a surface-modified PDMS mold Choi, WM; Park, OOk, MICROELECTRONIC ENGINEERING, v.70, no.1, pp.131 - 136, 2003-10 | |
The fabrication of micropatterns of a 2D colloidal assembly by electrophoretic deposition Choi, WM; Park, OOk, NANOTECHNOLOGY, v.17, no.1, pp.325 - 329, 2006-01 | |
Thermal and mechanical properties of syndiotactic polystyrene/organoclay nanocomposites with different microstructures Park, CI; Choi, WM; Kim, MH; Park, OOk, JOURNAL OF POLYMER SCIENCE PART B-POLYMER PHYSICS, v.42, no.9, pp.1685 - 1693, 2004-05 | |
Synthesis and material properties of syndiotactic polystyrene/organophilic clay nanocomposites Kim, MH; Park, CI; Choi, WM; Lee, JW; Lim, JG; Park, OOk; Kim, JM, JOURNAL OF APPLIED POLYMER SCIENCE, v.92, no.4, pp.2144 - 2150, 2004-05 | |
Effects of organoclay modification on microstructure and properties of polypropylene-organoclay nanocomposites Lee, JW; Kim, MH; Choi, WM; Park, OOk, JOURNAL OF APPLIED POLYMER SCIENCE, v.99, no.4, pp.1752 - 1759, 2006-02 | |
Micropatterns of colloidal assembly on chemically patterned surface Choi, WM; Park, OOk, COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS, v.277, no.1-3, pp.131 - 135, 2006-04 | |
A soft-imprint technique for submicron structure fabrication via in situ polymerization Choi, WM; Park, OOk, NANOTECHNOLOGY, v.15, no.1, pp.135 - 138, 2004-01 | |
A soft-imprint technique for submicron-scale patterns. using a PDMS mold Choi, WM; Park, OOk, MICROELECTRONIC ENGINEERING, v.73, no.4, pp.178 - 183, 2004-06 | |
The fabrication of submicron patterns on curved substrates using a polydimethylsiloxane film mould Choi, WM; Park, OOk, NANOTECHNOLOGY, v.15, no.12, pp.1767 - 1770, 2004-12 | |
Microfabrication of polypyrrole using patterned ITO substrate by the soft-imprint technique Choi, WM; Park, OOk, CURRENT APPLIED PHYSICS, v.6, no.4, pp.695 - 699, 2006-07 |
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